Media Summary: System-Level Design talks with Sonics CEO Grant Pierce about the How do you design and verify a package with tens of millions of pins without losing months to manual rework? In this episode of ... Presented by Jorgen Lundgren, Entegris senior field applications engineer at SEMICON Europa 2013.
3d Ic Stacking Challenges - Detailed Analysis & Overview
System-Level Design talks with Sonics CEO Grant Pierce about the How do you design and verify a package with tens of millions of pins without losing months to manual rework? In this episode of ... Presented by Jorgen Lundgren, Entegris senior field applications engineer at SEMICON Europa 2013. Juan Rey, senior director of engineering for Mentor Graphics' Design To Silicon Division, talks about The pursuit of increased performance and transistor density will be realized not just by making transistors smaller, but also ... To compensate for the gradual slowing down of Moore's Law scaling, we need to introduce other techniques. One option is to ...
Chiplets aren't the only way forward in chip design. This deep dive explores an alternative that starts with layered logic ... Event: CIE-SF Seminar Date and time: Sat 12/11, 3pm-4pm PST Venue: Zoom (Eventbrite registration required) Speaker: Dr. C. T. ... Density is the enemy of reliability. Discover how Manish Ranjan, Ultratech; Thorsten Matthias, EV Group; Mark Berry, Metryx; Robert Newcomb, Qcept Technologies; Akira Morita, ... Why are companies rapidly adopting fan-out wafer-level packaging (FOWLP)—and how does this shift impact the traditional chip ... According to ITRS, logic transistor scaling faces limitation at 10nm. No more cost advantage could be expected from further ...
Why is thermal analysis no longer an afterthought in Shifting left to integrate testing as early as possible in the design cycle is one of the best ways to speed up product development.
