2023 Eri Summit Meet Us

Dr. Todd Bauer, Program Manager of DARPA MTO, introduces "(

Dr. Todd Bauer, Program Manager of DARPA MTO, introduces "(

Dr. Daniel Friedman, IBM Senior Manager and Distinguished Research Scientist of Communication Circuits and Systems, ...

Dr. Matt Francis, President and CEO of Ozark Integrated Circuits, presents "High Temperature: The Next Frontier of Computing for ...

Dr. Bill Carter, Boeing Vice President of Materials and Manufacturing Technology, presents "Boeing & Microelectronics."

Dr. Stefanie Tompkins, Director, Defense Advanced Research Projects Agency (DARPA)

Dr. PR “Chidi” Chidambaram, Qualcomm Vice President of Engineering and Fellow, presents "Semiconductor Technology and ...

... honored to have Senator Maria Cantwell here in Seattle today to help kick off the

... forward conferences Series last year we are pleased to welcome congressman adaman Adam Smith to the

Dr. Elaine Tang, Siemens' Senior Key Expert, presents "Latest Results and Upcoming Challenges in Simulation of 3D ICs."

Dr. Anna Tauke-Pedretti, Program Manager of DARPA/MTO, introduces "Creating the 3D Microsystems of Tomorrow."

Dr. Josh Fryman, Fellow of Intel Corporation, presents "New Applications Enabled by Complex 3D Microsystems."

2023 ERI Summit: Hype Video

Mr. John Davies, Program Manager of DARPA MTO, introduces "Edge Intelligence Under Uncertainty."

Mr. Vinay Patwardhan, Cadence's Product Management Group Director of Digital Design and Implementation, presents "Results ...

Mr. Stephen Welby, White House Office of Science and Technology Policy Deputy Director for National Security, presents "Federal ...

Dr. Sung Kyu Lim, Program Manager of DARPA MTO, introduces "3D IC EDA: What is Needed, and How/When Can We Deliver?".

Dr. Mark Rosker, Director, DARPA/MTO.

Dr. WooPoung Kim, Corporate EVP and Head of Packaging Solutions Center of Samsung

Dr. Andrew Schwartz, Office of Science Director of Material Sciences and Engineering Division of the Department of Energy, ...